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Achieving fine pattern processing that was not possible with conventional FPC boards!
【Features】 1. Fine patterning with a pitch of 30μm (L&S = 15/15μm) is possible. 2. Depending on specifications, connection bumps can be formed on the pattern or the backside. 3. By combining laser processing and plating technology, through-hole conduction treatment on both sides is possible.
Achieving fine pattern processing using methods such as etching and additive techniques!
FPC (Flexible Printed Circuit) boards are circuit boards that use polyimide film as the base material and have copper electrodes patterned on them. Since the base substrate does not use organic materials such as adhesives, it can be used in high-temperature environments. Additionally, Howa Sangyo Co., Ltd. has achieved fine pattern processing that was not possible with conventional FPC boards by using methods such as etching and additive processes. Fine patterning of less than 50μm is possible. Depending on the specifications, connection bumps can be formed on the pattern or the back side. Furthermore, by combining laser processing and plating technology, through-hole conduction treatment on both sides is possible. For more details, please contact us or refer to the catalog.
