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Achieving fine pattern processing that was not possible with conventional FPC boards!
【Features】 1. Fine patterning with a pitch of 30μm (L&S = 15/15μm) is possible. 2. Depending on specifications, connection bumps can be formed on the pattern or the backside. 3. By combining laser processing and plating technology, through-hole conduction treatment on both sides is possible.
Achieving fine pattern processing using methods such as etching and additive techniques!
FPC (Flexible Printed Circuit) boards are circuit boards that use polyimide film as the base material and have copper electrodes patterned on them. Since the base substrate does not use organic materials such as adhesives, it can be used in high-temperature environments. Additionally, Howa Sangyo Co., Ltd. has achieved fine pattern processing that was not possible with conventional FPC boards by using methods such as etching and additive processes. Fine patterning of less than 50μm is possible. Depending on the specifications, connection bumps can be formed on the pattern or the back side. Furthermore, by combining laser processing and plating technology, through-hole conduction treatment on both sides is possible. For more details, please contact us or refer to the catalog.
![[Research Material] Global Market for FPC (Flexible Printed Circuit Boards)](https://image.mono.ipros.com/public/product/image/e7c/2001476878/IPROS50319368345266290549.jpeg?w=280&h=280)
World Market for FPC (Flexible Printed Circuit Boards): Single-sided Circuits, Double-sided Circuits, Multi-layer Circuits, Rigid-flex Circuits, Medical, Aerospace & ...
This research report (Global FPC Market) investigates and analyzes the current state of the global market for FPC (Flexible Printed Circuit Boards) and its outlook for the next five years. It includes information on the overview of the global FPC market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the FPC market by type include single-sided circuits, double-sided circuits, multilayer circuits, and rigid-flex circuits, while the segments by application cover medical, aerospace & defense/military, consumer electronics, automotive, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of FPC (Flexible Printed Circuit Boards). It also includes the market share of major companies in the FPC (Flexible Printed Circuit Boards) sector, product and business overviews, and sales performance.
2005 Two-layer FPC/COF Market Demand Outlook and Analysis of Two-layer CCL Production Trends
Focusing on the rapidly growing two-layer FPC, we conducted demand forecasting by application and clarified trends in the market, applications, manufacturers, and types. Additionally, regarding the two-layer CCL, which is facing supply constraints due to a sharp increase in demand, we investigated and analyzed the production status and expansion plans of each two-layer CCL manufacturer to clarify the current supply and demand situation. This provides an outlook on the future of two-layer FPC/CCL.
